【资料图】
金能科技融资融券信息显示，2023年7月31日融资净买入226.01万元；融资余额3.38亿元，较前一日增加0.67%
融资方面，当日融资买入396.29万元，融资偿还170.27万元，融资净买入226.01万元。融券方面，融券卖出8000股，融券偿还1.36万股，融券余量19.73万股，融券余额169.49万元。融资融券余额合计3.4亿元。
金能科技融资融券交易明细（07-31）
金能科技历史融资融券数据一览
免责声明：本文基于大数据生产，仅供参考，不构成任何投资建议，据此操作风险自担。
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